IC Package Design Engineer

Taipei, Taiwan, Taiwan


Role Number:200551336
Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! Our Hardware Technology Packaging team invents, designs, develops and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. You will own and drive sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/ thermal performance for various types of chips.


Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips. Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection. Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows. Work multi-functionally to optimize package pin out. Perform extraction of S-parameters and package RLGC model. Ensure package design is optimized with SI/PI requirements. Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution. Explore, evaluate and develop new CAD tool, design and verification flow. Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size. Internal Details

Minimum Qualifications

Key Qualifications

  • As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
  • Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
  • Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules and material property.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
  • Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
  • Preferred Skills:
  • Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
  • Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
  • Solid understanding of Design Rules Check and Design for Manufacturing.

Preferred Qualifications

Education & Experience

BS and above with 3+ years of relevant industry experience

Additional Requirements