Camera Process Development Engineer
Longtan, Taiwan, Taiwan
Hardware
At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.
These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?
As Process Development Engineer, you will be responsible to develop assembly processes, equipment and materials for leading edge optical modules. Working closely in a collaborative relationship with subcontract manufacturing partners engineering teams, you will develop the HVM infrastructure required to produce the highest quality hardware.
Key Qualifications
- Over 5 years hands-on experience in semiconductor module packaging, especially, Camera Module, laser, LED or camera components such as actuator, optics, etc.
- Proficient in English communication, additional language skills a plus
- Experienced working with subcontract manufacturing partners
- High volume manufacturing, and production ramp experience
- Knowledgeable in production control processes, machine commissioning, data analysis/interpretation GR&R, Cp/Cpk and correlation analysis, MSA
- Ability for International business travel to support project development, and support product manufacturing. Travel frequency is minimum 70% of working day.
Description
Develop Camera Module assembly process / equipment / materials for FOL (Front Of Line) and EOL (End Of Line)
Develop new assembly process / equipment / material for Camera module related components
Provide technical leadership in resolving any process or test related issue
Responsible for developing DOEs, Statistical Process Analysis, Process specification, D/PFMEA and process control plan.
Experience in semiconductor module assembly required, with camera module, laser optics, LED and prox modules is a plus.
Responsible for Failure analysis, Corrective actions and Yield improvement
Education & Experience
B.S. degree in Engineering (Mechanical, Electronics, Electrical, Physics, or equivalent)