Intern - Design For Manufacturing
Singapore, Singapore, Singapore
Operations and Supply Chain
The DFM R&D group is seeking an intern to work in the area of electronics packaging & associated technologies. The candidate must be committed to work full-time for a period of 6 months. The successful candidate in this role will be able to work in a lab environment to assist the team to deliver scalable manufacturing processes in a timely manner. Open to students (Bachelor/Master/PHD) from the following faculties: - School of Electrical and Electronic Engineering - School of Material Science - Or other relevant courses related to electronics packaging
- Good communication skills
- Desire and ability for problem solving and debugging
- Some experience with projects in industries is desirable.
Work in a lab environment to provide engineering support for product builds as well as assist the team to develop and transfer processes for semiconductor packaging.
Education & Experience
Currently pursuing Bachelor/M.S./PhD in Electrical, Electronics Engineering, Material science or other courses related to electronics packaging
- -Full time internship
- - 6 months
- -Ideal starting period: Jan 2020
- -Location: Singapore