Intern - Design For Manufacturing

Singapore, Singapore, Singapore
Operations and Supply Chain

Summary

Posted:
Weekly Hours: 40
Role Number: 200105189
The DFM R&D group is seeking an intern to work in the area of electronics packaging & associated technologies. The candidate must be committed to work full-time for a period of 6 months. The successful candidate in this role will be able to work in a lab environment to assist the team to deliver scalable manufacturing processes in a timely manner. Open to students (Bachelor/Master/PHD) from the following faculties: - School of Electrical and Electronic Engineering - School of Material Science - Or other relevant courses related to electronics packaging

Key Qualifications

  • Good communication skills
  • Desire and ability for problem solving and debugging
  • Some experience with projects in industries is desirable.

Description

Work in a lab environment to provide engineering support for product builds as well as assist the team to develop and transfer processes for semiconductor packaging.

Education & Experience

Currently pursuing Bachelor/M.S./PhD in Electrical, Electronics Engineering, Material science or other courses related to electronics packaging

Additional Requirements

  • -Full time internship
  • - 6 months
  • -Ideal starting period: Jan 2020
  • -Location: Singapore