Senior Electronics Packaging Engineer

Singapore, Singapore, Singapore
Operations and Supply Chain


Weekly Hours: 40
Role Number:200186509
We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation. We are seeking an experienced professional who brings expertise in the area of semiconductor packaging technologies. This engineer will lead the efforts in the development of advanced SiP processes for emerging technologies such as 5G . The successful engineer in this role will be able to work in a challenging lab environment as well as at contract manufacturer sites to develop novel technologies & deliver scalable manufacturing processes in a timely manner

Key Qualifications

  • Strong familiarity with various packaging processes for SiP including SMT, die attach, molding, wire bonding & interconnect technologies
  • Knowledge of FEA & modeling tools like ANSYS
  • Extensive experience working with packaging materials & characterizations
  • Experience/background working with OSATs/suppliers worldwide
  • Desire and ability for problem solving and debugging. Problem solver for the team with the ability to explain in fundamentals of physics.
  • Ability to work with a wide range of people with varying degrees of experience & knowledge
  • Ability to lead cross functional teams & drive results
  • Strong analytical skills & excellent communication skills
  • Good knowledge of failure analysis & metrology
  • Hands on assistance at lab whenever required
  • Some international travel up to 30% of the time


- Work in a lab environment to develop & characterize advanced SiP & RF packaging concepts & designs - Recommend designs to meet demanding requirements of reliability. Identify & resolve issues in functionality & reliability in advance during prototyping or conception. - Review the design of new packages & provide guide lines & knowhow to meet Design for Manufacturing - In depth assessment of thermal & mechanical impacts of SiP assemblies & RF packaging architectures - Propose solutions & improvements for enhancing robustness of packaging - Provide technical consultation & guidance to engineers on the fundamentals of packaging technologies & comparisons. - Good knowledge of modeling & simulation using tools like Ansys - Closely work with cross functional teams to develop & launch process solutions fit for manufacturing

Education & Experience

PhD or Masters in Physics, Material Science, Electronics or related areas with 10+ years’ experience at senior technical levels

Additional Requirements