DFM Molding Engineer

Santa Clara Valley (Cupertino), California, United States
Hardware

Summary

Posted: Oct 22, 2018
Weekly Hours: 40
Role Number: 114380763
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. The people here at Apple don’t just create products — they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it. The DFM group is seeking an experienced professional who brings expertise in the area of semiconductor packaging over-mold technology. This engineer will assist in the development and refinement of over-molding technologies and systems for semiconductor devices and substrates. The successful engineer in this role will be able to work both in a lab environment as well as at contract manufacturer sites, interacting with suppliers and deliver scalable manufacturing processes in a timely manner.

Key Qualifications

  • 6+ years experience related work experience preferred
  • Extensive experience working with molding materials and process technologies
  • Hands-on experience with transfer, injection and/or compression mold equipment is a requirement
  • Experience/background working with Asian manufacturers & suppliers desired
  • Possess desire and ability for problem solving & debugging
  • Ability to work with a wide range of people with varying degrees of experience
  • Strong communication & interpersonal skills
  • Experience with SMT technologies & equipment
  • Experience with underfill materials and processes

Description

- You will work with external contract manufacturers and internal product designers to develop molding processes/solutions collaborating closely with suppliers for semiconductor packaging over-mold equipment and material vendors - Scope and select suitable equipment and solutions suitable for product requirements - Provide engineering support for product builds at the factory - Work with Operations group and the extended supply chain to address tooling and process lead-times

Education & Experience

BS or MS in Physics, Material Science or related education

Additional Requirements