IC Packaging Intern
Santa Clara Valley (Cupertino), California, United States
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product. Do you love working on challenges that no one has solved yet? As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple’s customers every single day. Integrated Circuit (IC) is the brain of modern electronics. IC Packages are the mechanical and electrical interfaces of ICs and the environment. IC Packaging is a challenging multidisciplinary field that attracts some of the top talents in the industry. Apple is an Equal Opportunity Employer that is committed to inclusion and diversity. We also take affirmative action to offer employment and advancement opportunities to all applicants, including minorities, women, protected veterans, and individuals with disabilities. Apple will not discriminate or retaliate against applicants who inquire about, disclose, or discuss their compensation or that of other applicants.
- Hands-on experience of major mechanical design CAD tools, such as NX, AutoCAD, SpaceClaim, SolidWorks, etc.
- Hands-on experience of setting up equipment and data acquisition systems.
- Excellent written and verbal communication skills. Able to present ideas, data and plans with high confidence at team meetings
- Hands-on experience of major material analysis and failure analysis tools (e.g., SEM, EDX, FIB, CSAM, etc.) is a plus.
As an IC Packaging Intern in Apple, you will work on characterizing IC packages. You will also be involved in developing methodologies of materials characterization of IC packaging. Characterizing IC packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing, etc. Characterizing key packaging materials, such as solders, polymers, etc. Developing characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test.
Education & Experience
In the program of BS, MS, or PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields.