Wireless Hardware Design Lead
Santa Clara Valley (Cupertino), California, United States
Would you like to join Apple’s growing wireless silicon development team? Our wireless SOC organization is responsible for all aspects of wireless silicon development with a particular emphasis on highly energy efficient design and new technologies that transform the user experience at the product level, all of which is inspired by a world-class vertically integrated engineering team spanning RF/Analog architecture and design, Systems/PHY/MAC architecture and design, VLSI/RTL design and integration, Emulation, Design Verification, Test and Validation, and FW/SW engineering. As a Wireless Hardware Design Lead, you will be responsible for crafting development boards and reference designs for testing and evaluating emerging wireless chip technologies.
- We expect you to have 3+ years of hands-on management experience.
- Extensive experience with developing test boards to collaborate with wireless chips, FPGAs, PMUs, sensors, and other peripheral support chips over a variety of digital interfaces, including I2C, JTAG, UART, SPI, SPMI, and PCIe based on preliminary chip specifications.
- Experience with designing power distribution and filtering networks for wireless chips.
- Experience with hardware bring-up, bench evaluation, and troubleshooting using oscilloscopes, logic analyzers, spectrum analyzers, network analyzers, and wireless testers.
- Deep understanding of PCB design principles for minimizing unwanted coupling and Rx desense.
- Familiarity with DV tools.
- Understanding of DFM, DFT, SI, and PI principles for Wireless PCB design, including RF interface requirements of characteristic impedance and matching.
You will lead a team of Design Engineers that work closely with internal chip and package design and chip integration teams to design, build and validate development boards required for chip bring-up and characterization. You will also work with external component vendors, PCB houses, and Apple factories to support wireless chips over their lifecycle, including application engineering support for product development teams. Responsibilities include: - PCB component selection and specification, including sockets for testing wireless chips. - Schematic collection and layout using Concept/Allegro and Altium. - PCB construction requirements to meet SI and reliability requirements testing wireless chips. - Mechanical part design and modeling with tools such as Solidworks and NX. - Leading vendors for PCB and mechanical part fabrication and assembly, and well as prototype part fabrication using 3-D printing. - Providing AE support for engineers integrating wireless chips into final products.
Education & Experience
BSEE is a requirement. MSEE is preferred.