Senior Packaging/Process Engineer, Optical Sensors Team

Santa Clara Valley (Cupertino), California, United States
Hardware

Summary

Posted:
Weekly Hours: 40
Role Number:200122578
Apple’s PPO Sensing Group is looking for a senior semiconductor module packaging engineer to work on new sensing hardware development. Represent the module Packaging function as part of the engineering cross functional team, and direct the process development activities. Responsible to deliver a scalable and reliable manufacturing process, materials and equipment, that meet the challenging design requirements of Apple products.

Key Qualifications

  • 10+ years of semiconductor packaging or related experience
  • Experience from development through volume manufacturing
  • Strong interpersonal and communication skills
  • Degree in Engineering, Physics, Materials Science or related

Description

- Represent module packaging within cross functional team to develop innovative and manufacturable module designs - Work through our manufacturing partners to define and develop the MP intent assembly process, materials and equipment. - Coordinate/Lead the In-Region Apple team to execute the development activities - Define packaging roadmap based on long term packaged product requirements, and influence the supplier’s R&D activities to support our roadmap - Be an effective advocate with the team for the packaging functions

Education & Experience

BS/MS/PhD in Electrical Engineering, Mechanical Engineering or equivalent

Additional Requirements