Technical Program Manager - Substrates
Santa Clara Valley (Cupertino), California, United States
Operations and Supply Chain
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Here at Apple we don’t just create products — we create the kind of wonder that’s revolutionized entire industries. It’s the diversity of our people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts.
- Typically requires at least 7+ years of experience in Semiconductor Packaging Design and New Product Introduction
- Experience in substrate design and layout and tape out process.
- Knowledge and experience in IC packaging, SIP Module packaging, single die packaging and heterogeneous package integration a plus.
- Familiarity with the properties and process used in microelectronics fabrication and PCBA assembly.
- Strong engineering physics, including electrical, electro-magnetic, thermal, and mechanical interactions.
- Knowledge of circuits, schematics, engineering requirements and device specifications.
- Experience with placement studies, layouts, system architecture, routing studies.
- Required to understand and tolerance stack ups for assemblies and part level.
- Deep level of creativity and curiosity about materials science and electronics packaging at all levels.
- Ability to communicate effectively in a worldwide environment.
- Consistent record of working with internal teams and international vendors/OEMs to execute introduction of new packaging and technology solutions.
- Willingness and ability to travel internationally up to 40%.
The Substrates Technical Program Manager works in conjunction with the New Production Introduction and Engineering groups to enable operational success for the entire product introduction cycle through mass production. This role is focused on 3 key areas: • Design for Manufacturability: Provide early and ongoing manufacturing involvement to ensure manufacturability of new products. Work with system teams to help define package structure, component placement, layout routing studies. Lead multi-functional teams and drive package integration efforts. Work with vendors to bring IC packaging solutions from concept to mass production. Conduct and approve packaging proposals, designs, schematics, process flows, risk assessments, technical specifications, reliability requirements, data collection, and analysis. • Process Engineering: Designs and develops technically complex processes to improve quality and efficiency. • Failure/Data Analysis: Plans, develops and implements technically complex procedures for the testing and evaluation of soon to be released products. Specifies test to be performed, compiles data and makes recommendations for product design changes and final assembly standards. This will include the use of Design of Experiments (DOE) and statistical analysis using Six Sigma principles.
Education & Experience
BS/MS in Engineering (PhD is nice to have but not required)