Sensor Packaging Engineer

Cupertino, California, United States
Hardware

Summary

Posted:
Role Number:200542026
Apple’s Hardware Engineering group is looking for an electronic packaging engineer to work on a broad range of sensor modules. The candidate should have a strong track record of new module development and scaling to high volume production! We work at a fast-pace and attention to detail goes into everything we do!

Key Qualifications

  • Semiconductor or electronic packaging/assembly experiences related to process engineering skills, integrating processes such as precision die attach, wire bonding, flip chip assembly, precision dispensing, lamination, molding, flex bending, flex attach, and wafer thinning.
  • Fundamental understanding of electronic packaging materials. Experience developing new materials with external suppliers is a plus.
  • Experience working on new automation to meet design goals.
  • Proficient in a detailed, logical approach to module development with DFM and FMEA exercises with the multi-functional teams.
  • Experience working with and influencing external supplier partners.
  • Experience working with remote teams to manage process development activities.
  • Clarity, conciseness, and coherence a must in written and verbal communication.

Description

The position is responsible for developing processes, materials, and equipment for novel sensor packaging to integrate with various Apple products. The key activities are- - Work with product design teams to provide design manufacturability - Manage process bring-up with manufacturing partners and OSAT - Identify key process risks and provide solutions - Establish mass-production-intent process - Collaborate with operations teams to transfer process ownership for production - Prepare executive reporting

Education & Experience

BS and a minimum of 10 years relevant proven industry experience in Optics, Physics, Opto-mechanics, Electrical Engineering, or Mechanical Engineering.

Additional Requirements

Pay & Benefits