SOC Thermal Engineer

Santa Clara, California, United States
Hardware

Summary

Posted:
Role Number:200559812
Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

Description

This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance Developing detailed and reduced-order thermal models Analyzing simulation and measurement results to enhance product thermal management

Minimum Qualifications

  • Deep fundamental understandings on thermal conduction, convection and radiation. Strong experimental and analytical skills.
  • Ability to drive and lead cross-functional teams to execute on “design for thermal”.
  • Familiarity with at least one programming language (Python, Matlab, C++ or others etc.).
  • Master or Doctoral degree in mechanical engineering.
  • Experience in modeling or analyzing transient thermal response and reduced-order modeling.

Key Qualifications

Preferred Qualifications

  • Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages and mobile devices.
  • Knowledge of semiconductor, package, PCB or mobile device design and thermal testing.
  • Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies.
  • Knowledge of SoC design methodology, low-power techniques and thermal analysis methods.
  • Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages.
  • Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk etc.
  • Experience of data center cooling solution analysis, design and test.

Education & Experience

Additional Requirements

Pay & Benefits

  • Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.