DFM Process Engineer

Shanghai, Shanghai, China
Operations and Supply Chain


Weekly Hours: 40
Role Number:200379836
The Apple DFM (Design for Manufacturing) group is seeking an experienced professional with expertise in the area of semiconductor packaging processes. This engineer will assist in the development of assembly and packaging process for SiP (System-in-package) modules and MLBs. The successful engineer in this role will be able to work both in a lab environment as well as at contract manufacturer sites, interacting closely with suppliers to deliver scalable manufacturing processes in a timely manner.

Key Qualifications

  • Extensive experiences with SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials and processes, all in the context of high-volume semiconductor/packaging/electronics manufacturing
  • Prior experience with development and qualification of semiconductor packages a plus
  • Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, and data analysis
  • Ability to work with a wide range of people with varying degrees of experience
  • Excellent communication skills


Work with external contract manufacturers and internal product designers to develop SMT, molding, sputtering, Laser and saw processes/solutions collaborating closely with suppliers for semiconductor packaging equipment and material vendors Provide engineering support for product builds at the factory, do data analysis and FA, report build status Monitor and drive closure of any reliability and yield issues with factory Work with Operations group and the extended supply chain to address production ramp and MP needs

Education & Experience

Ph.D. or M.S. in Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related fields; B.S with 8+ years experience

Additional Requirements