Camera SIPI Engineer - Camera Hardware

San Diego, California, United States
Hardware

Summary

Posted:
Weekly Hours: 40
Role Number:200543574
Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you’ll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You’ll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You’ll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we’ll craft a magical photography experience that redefines what millions of customers can expect from their cameras. The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware for all related Apple products. Our target is to deliver superior camera hardware to enable best-in-class camera user experience. We are looking for an enthusiastic, high energy individual who can help us with tomorrow’s challenges.

Key Qualifications

  • Academic or industry exposure to camera or SI/PI technical areas and/or electro-magnetic concepts
  • Experience on substrate, package or flex/board level SI/PI simulations
  • Understanding of high speed signal and/or PDN fundamentals
  • Use of main-stream tool chain e.g HFSS, SI-Wave/PSI, Q3D, CST and ADS
  • Comfortable to handle VNA/TDR or Oscilloscope in academic or professional settings
  • Great interpersonal skills to work with multi-functional teams
  • Highly self-motivated and proactive with critical thinking

Description

Model and analyze camera sub-system SI/PI performance & EM (Desense & Susceptibility) risk and provide feedback/recommendations for design optimization Assist senior team members to drive new design characterization, validation and correlation Collaborate with system team for high speed channel and power delivery network budgeting for camera feature integration Participate in design feasibility studies for future technologies Develop new simulation methodologies for sign-off analysis

Education & Experience

BS and a minimum of 3 years relevant industry experience

Additional Requirements

  • Familiarity with substrate/package material property and selection
  • Academic knowledge or experience with image sensor or camera module
  • Proficient in using JMP for statistical analysis
  • Experience in Python scripting for automating simulation setup

Pay & Benefits