Process Engineer (SiP/SMT)

Shanghai, Shanghai, China
Operations and Supply Chain

Summary

Posted: 2019 年 3 月 22 日
Weekly Hours: 40
Role Number: 114026863
The DFM group is seeking an experienced professional who brings expertise in the area of semiconductor packaging processes. This engineer will assist in the development of assembly and packaging process for SiP modules and MLBs. The successful engineer in this role will be able to work both in a lab environment as well as at contract manufacturer sites, interacting closely with suppliers and deliver scalable manufacturing processes in a timely manner.

Key Qualifications

  • Extensive experience working with SMT, underfill and molding materials and process technologies
  • Hands-on experience with assembly processes and equipment including SMT process tools, dispensers, and transfer/injection/compression mold equipment is the ideal requirement
  • Prior experience with development and qualification of semiconductor packages a plus
  • Desire and ability for problem solving and debugging
  • Ability to work with a wide range of people with varying degrees of experience
  • Excellent communication skills
  • Nice to have: Experience with solder and polymer material developments
  • Nice to have: Experience with underfill materials and processes

Description

Work with external contract manufacturers and internal product designers to develop SMT, underfill, molding processes/solutions collaborating closely with suppliers for semiconductor packaging equipment and material vendors Provide engineering support for product builds at the factory Monitor and drive closure of any reliability and yield issues with factory Work with Operations group and the extended supply chain to address tooling and process lead-times

Education & Experience

B.S or M.S in Mechanical Engg, Chemical Engg, Physics, Material Science or related with 6+ years experience

Additional Requirements