Antenna/RF Instrumentation Design Engineer

Shenzhen, Guangdong, China
Hardware

Summary

Posted: 2019 年 1 月 7 日
Role Number: 200025896
As a Antenna/RF Instrumentation Design Engineer you will be part of a team within Apple’s antenna design laboratory who designs module- and system-level test/validation instrumentation solutions. These solutions support the product antenna designers during development and manufacturing. You have the following skills and knowledge: • develop, define, design, validate, and implement instrumentation •perform test station validation experiments • conduct radiation measurements including TRP/TIS • create and execute test plans, analyze and publish test data, provide feedback to the other design engineers, and lead some of the manufacturing of the antenna architecture • work closely with the product design teams, RF design teams, mechanical designers, and operations

Key Qualifications

  • 3+ years of experience in RF with antenna design academic experience and test for wireless consumer products
  • Must have academic or professional experience in signal integrity, antenna design and testing, anechoic chambers, or RF test equipment
  • Hands-on is a must
  • Must have strong problem solving skills and working knowledge of radiation performance. Antenna and wave propagation theoretical background is essential.
  • Familiarity with different wireless communication systems such as GSM/GPRS/EDGE, 802.11, Bluetooth, etc. is a plus
  • Experience with simulation tools such as XFDTD, ADS, HFSS, CST is a plus
  • Excellent communication skills required, both written & verbal
  • Detail oriented - taking data, using Excel, and making meaningful tables/graphs/averages

Description

As a Antenna/RF Instrumentation Design Engineer you will be part of a team within Apple’s antenna design laboratory who designs module- and system-level test/validation instrumentation solutions. These solutions support the product antenna designers during development and manufacturing. Job breakdown • based in China, 25% domestic travel between contract manufacturers, suppliers, and vendors to bring up and validate the designs, 10% travel to California having team sync up per quarter/semi-annual • 30%: instrumentation design – PCB, flex, interconnect, probes, and antennas Efforts will combine lab work and 3D EM simulation (CST, HFSS) • 30%: coding and developing scripting for data post-processing, analyzing manufacturing data • 30% in contract manufacturers “technical lead”, e.g. bring up, train, maintain team support level on testing, doe, communication, etc • 10%: in vendor/supplier “technical lead” roles e.g. communicating and coordinating projects with vendor

Education & Experience

BSEE required, MSEE or PhD is preferred

Additional Requirements