Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.
We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.
Key Qualifications
- Extensive experience in thermal analysis and thermal measurement.
- Measuring or modeling transient thermal response and reduced-order modeling of heat transfer.
- Deep fundamental understandings on thermal conduction, convection and radiation.
- Experience in Matlab, Python or C++ coding
- Familiarity with Ansys ICEPAK, Sentinel-TI, Fluent, Cadence Allegro, Redhawks SCET, CFD-ACE, or Star CCM is a plus
Description
This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance, Developing detailed and reduced-order thermal models Analyzing simulation and measurement results to enhance product thermal management
Education & Experience
BS and 3+ years of relevant industry experience