Mixed-Signal IC Product Engineer (Japan Design Center)

Minato, Tokyo-to, Japan


Role Number:200545703
Join us. Be you! This is where individual creativities gather together, contributing to the values that lead to great work. Here, you’ll do more than join something - you’ll add something. We bring amazing people together to make amazing things happen. The position of Mixed-Signal IC Product Engineer is responsible for development and mass production of new IC. This includes characterization and qualification of new IC; Definition and validation of manufacturing test flow and conditions; Failure analysis and implementation of corrective actions; Yield improvement efforts; Interface and manage foundry/vendors, drive activities.


- Perform statistical analysis on test data, correlation analysis for failure isolation from various perspectives (e.g., design, test, process), then take an appropriate corrective action by working with design team, test team and foundry, respectively. - Work with foundry to keep stable yield by statistical product control, and manage DOE (Design of Experiment) for further yield improvement from wafer process perspective. - Work with foundry to run failure analysis which includes the failure mode caught at wafer level test, qualification, characterization, downstream test and field return. - Manage the characterization activities; make a plan with design team, prepare characterization test program with test team, make the instruction for foundry, analyze data over PVT. - Manage the qualification activities (e.g., ESD, Latch-up, HTOL); make a plan with design team, prepare Pre/Post test program with test team, make the instruction for foundry, analyze data before and after stress. - Optimize the test limit by considering the guard-band specifications based on characterization, qualification and GR&R data. - Additional tasks might be required, depending on business situation.

Minimum Qualifications

Key Qualifications

  • The ideal candidate should have 10+ years of product engineering experience.
  • Knowledge of silicon wafer process, test, characterization and qualification.
  • Experiences in yield and quality management through the development and mass production of new IC.
  • Knowledgeable in statistical product control (e.g., lot disposition).
  • Ability to manage DOE (Design of Experiment) for problem solving (e.g., yield improvement based on the failure analysis).
  • Knowledge of the basics of semiconductor devices and chip design, experience to work with design team.
  • Business level English communication skills to work with internal team and foundry.

Preferred Qualifications

Education & Experience

BSEE/MSEE or equivalent is required

Additional Requirements

  • - Leadership to drive internal team and foundry is plus.
  • - Experience in analog design or digital design is plus.