IC Packaging Engineer
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, hard-working and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product!
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for perfection to work towards an extraordinary result? We are looking for a talented and passionate IC Packaging Engineer. You will be responsible for IC packaging development and new product introduction for programs requiring SIP module packaging and substrate-based IC packaging. Looking for individuals who are innovative, creative, driven, and work well within a team.
- Work with cross-functional teams and lead package integration and architecture efforts.
- Work with 3rd party and OSATs to bring IC packaging solutions from concept to mass production.
- Work to bring innovative packaging solutions from concept to mass production, including package, module and technology development.
- Conduct and approve packaging proposals, designs, schematics, process flows, risk assessments, technical specifications, reliability requirements, data collection, and analysis.
- Bachelors and 10+ years or relevant industry experience in Semiconductor Packaging Design, Process and New Product Introduction.
- Must have hands-on experience and expertise on IC packaging.
- Typically requires at least 5+ years of experience in Semiconductor Packaging Design, Process and New Product Introduction. Must have hands-on experience and expertise on IC packaging.
- Strong knowledge and experience in IC packaging, SIP Module packaging, single die packaging and heterogeneous package integration.
- Knowledge and experience package assembly process, materials, and equipment. Experience driving development of new enabling technology and roadmaps.
- Strong IC packaging materials background including characterization and failure analysis.
- Problem solver with strong engineering physics. Willing to tackle tough problems.
- Ability to work independently and work with multi-functional teams.
- Proven track record working with internal teams or vendors to execute introduction of new packaging and technology solutions.